Laird Technologies Expands EMI Gemini™ Multi-Extrusion Gasket Product Line
Expanded EMI Multi-Extrusion Elastomer Shielding Product Line Includes Gemini™ 81 and Gemini™ 93 Gaskets St. Louis, Missouri, USA – December...
Laird Technologies Introduces New Removable Top Board-Level Shield ReCovr™ Product Line
Patented Board-Level Shield Sets the Standard for Removable Top Shielding St. Louis, Missouri, USA – November 10, 2010 – Laird Technologies,...
Laird Technologies Releases New Tflex™ SF600 DF Silicone-Free Thermal Gap Filler
Gap Filler Specifically Designed for Silicone-Sensitive Applications St. Louis, Missouri, USA – October 19, 2010 – Laird Technologies, Inc.,...
Laird Technologies Releases New Tflex™ XS400 Series Thermal Gap Filler
Compliant Elastomer Gap Filler Provides Electrical Isolation with High Tolerance Stack-Up St. Louis, Missouri, USA – September 21, 2010 – La...
Laird Technologies Releases New Rigid Corner Board-Level Shield
New Corner Design Optimizes Part Rigidity for Improved Shielding Performance St. Louis, Missouri, USA – September 15, 2010 – Laird Technolog...
Laird Technologies’ EMI Experts Author Article for IN Compliance Magazine
Article Discusses EMI Shielding for Medical Devices and the Effects of Cleaning Solutions on Material Performance St. Louis, Missouri, USA –...
Laird Technologies’ EMI Engineer Authors Cover Story for IN Compliance Magazine
Subject Matter Expert Discusses EMI Shielding Principles St. Louis, Missouri, USA – June 29, 2010 – Laird Technologies, Inc., a global leade...
Laird Technologies Signs Tape Innovations as First Certified Converter for Thermal Interface Materials in North America
Converter Offers a Range of Services from Small Prototype to Production Builds St. Louis, Missouri, USA – May 27, 2010 – Laird Technologies,...
Laird Technologies Releases Thermal/EMI Combination Shield Design Case Study
Optimization of Thermal Simulation Software Reduces Design Time from Weeks to Days St. Louis, Missouri, USA – May 4, 2010 – Laird Technologi...
Laird Technologies Releases Enhanced Tlam™ SS LLD Thermally Conductive PCB Substrate
Low-cost, High-performance Thermal Substrate Specifically Designed for LED Module Applications St. Louis, Missouri, USA – April 15, 2010 – L...
Laird Technologies Releases White Paper on Automotive EMI Sources and Shielding
White Paper Discusses the Need for Containing and Suppressing Automotive EMI Potential through Shielding and Ferrite Solutions St. Louis, Mi...
Laird Technologies Introduces New EMI Gemini™ Product Line
New EMI Multi-Extrusion Elastomer Shielding Gasket Offers Lower Deflection at a More Cost-Effective Price St. Louis, Missouri, USA – Novembe...