Newsroom Laird Technologies Signs Tape Innovations as First Certified Converter for Thermal Interface Materials in North America Converter Offers a Range of Services from Small Prototype to Production Builds St. Louis, Missouri, USA – May 27, 2010 – Laird Technologies,...
Newsroom Laird Technologies Releases Thermal/EMI Combination Shield Design Case Study Optimization of Thermal Simulation Software Reduces Design Time from Weeks to Days St. Louis, Missouri, USA – May 4, 2010 – Laird Technologi...
Newsroom Laird Technologies Releases Enhanced Tlam™ SS LLD Thermally Conductive PCB Substrate Low-cost, High-performance Thermal Substrate Specifically Designed for LED Module Applications St. Louis, Missouri, USA – April 15, 2010 – L...
Newsroom Laird Technologies Releases White Paper on Automotive EMI Sources and Shielding White Paper Discusses the Need for Containing and Suppressing Automotive EMI Potential through Shielding and Ferrite Solutions St. Louis, Mi...
Newsroom Laird Technologies Introduces New EMI Gemini™ Product Line New EMI Multi-Extrusion Elastomer Shielding Gasket Offers Lower Deflection at a More Cost-Effective Price St. Louis, Missouri, USA – Novembe...
Newsroom Laird Technologies’ Engineer Recognized for Co-Developing IEEE Std 1302™ - 2008 Standard developed for IEEE Guide for the Electromagnetic Characterization of Conductive Gaskets in the Frequency Range of DC to 18 GHz St. ...
Newsroom Laird Technologies’ EMI Engineer Authors Book Subject Matter Expert Focuses on EMI Solutions in EMC Design St. Louis, Missouri, USA – September 8, 2009 – Laird Technologies, Inc., a glo...
Newsroom Laird Technologies Releases the First in a Series of Thermal Management Application Notes Thermoelectric Assemblies for Medical Industry Applications St. Louis, Missouri, USA – September 1, 2009 – Laird Technologies, Inc., a globa...
Newsroom Laird Technologies Releases New RFID HD RooTenna™ Series with Weatherproof Enclosure for Harsh Environments Innovative RFID Antenna System Delivers Ultimate System Flexibility St. Louis, Missouri, USA – August 4, 2009 – Laird Technologies, Inc., a ...
Newsroom Laird Technologies Develops New Phase Change Material for Intel® Products Offer High Performance, Reliability and Stability for the Most Sophisticated Computer Processing Products St. Louis, Missouri, USA ...
Newsroom LAIRD TECHNOLOGIES INTRODUCES T-lam™ SS LLD LAMINATE FOR BLU LED LIGHT ENGINES Metal Core PCB Offers High Performance and a Competitive Price St. Louis, Missouri, USA – February 14, 2008 – Laird Technologies, a global l...
Newsroom LAIRD TECHNOLOGIES ADDS TO ITS CONVERGENCE PRODUCT OFFERING Microwave Board Level Shield Combines Microwave Absorbers with Board Level Shielding For High Frequency Shielding ST. LOUIS, MO USA — (Febru...
