Newsroom Laird Releases Ultra-Low Height Board-Level EMI Shield Innovative patent pending design is ideal for applications with compact space requirements November 25, 2013 – Laird, a global technology co...
Newsroom Laird Expands EMI Shielding Portfolio with Edge Guide Clip-on Strip New Fingerstock product designed for electronic applications reduces installation labor November 20, 2013 – Laird, a global technology compa...
Newsroom Laird Introduces Tgard™ 400 Thermally Conductive Insulator New product reduces electrical shorts October 28, 2013 – Adding to the value of their thermally conductive insulator product line, Laird, a ...
Newsroom Laird Announces New TYS Series of SMD Power Inductors Power Inductors Enable Longer Battery Life in Portable Electronics August 23, 2013– Laird, a global technology company, announced the releas...
Newsroom Laird Announces Release of Wireless Charging Coil Modules Designed for Use in Wireless Charging Devices, Modules Meet Qi Global Standard August 2, 2013 – Laird, a global technology company, announce...
Newsroom Laird Technologies to Showcase EMI and Microwave Solutions at IEEE International Microwave Symposium and Exhibition 2013 Injection Moldable Materials, Board Level Shielding, Fingerstock will be Featured St. Louis, Missouri, USA – May 23, 2013 – When the IEEE In...
Newsroom Laird Technologies to Display Thermal Management Solutions at SPIE Defense, Security and Sensing Exhibition Company will Showcase Low-profile Thin-film Thermoelectric Solutions St. Louis, Missouri, USA – April 25, 2013 – Laird Technologies, Inc., a...
Newsroom Laird Technologies Expands EMI Metals Product Line with SMD Grounding Contacts SMD Grounding Contacts Specifically Designed for Electronics Applications St. Louis, Missouri, USA – January 7, 2013 – Laird Technologies, I...
Newsroom Laird Technologies Releases Two New Tflex™ Series Products Products are High-Performance Silicone-Free Gap Fillers St. Louis, Missouri, USA – December 6, 2012 – Laird Technologies, Inc., a global lea...
Newsroom Laird Technologies Introduces Board-Level Shield ReMovl™ Enhancement Feature Allows for Detachment of Pickup Bridge St. Louis, Missouri, USA – June 26, 2012 – Laird Technologies, Inc., a global leader in the d...
Newsroom Laird Technologies’ EMI Engineers Co-Author Cover Story for IN Compliance Magazine Subject Matter Experts Discuss Advancements in Board Level Shield Design St. Louis, Missouri, USA – June 14, 2012 – Laird Technologies, Inc....
Newsroom Laird Technologies Acquires Emerson & Cuming Microwave Products Purchase expands EMI Solutions portfolio with established product brands St. Louis, Missouri, USA – March 2, 2012 – Laird Technologies, Inc....
