Newsroom Laird Technologies Publishes EMI Microwave Absorber Application Note Topic Examines Microwave Absorbers for Collision Avoidance System Applications St. Louis, Missouri, USA – January 11, 2012 – Laird Technolog...
Newsroom Laird Technologies Expands Electrically Conductive Elastomer Line with EcE72 Silicone Gasket Gasket Provides Strong EMI Shielding and Environmental Sealing St. Louis, Missouri, USA – September 27, 2011 – Laird Technologies, Inc., a g...
Newsroom Laird Technologies Launches Interactive EMI Shielding Effectiveness Calculator Online Interactive Calculator Provides Instantaneous Shielding Effectiveness Computation of Shielding Materials St. Louis, Missouri, USA – A...
Newsroom Laird Technologies Publishes SMD Power Inductors Application Note Topic Discusses How Power Inductors Yield Lower Core Losses and Provide a Stored Energy Source St. Louis, Missouri, USA – July 21, 2011 – La...
Newsroom Laird Technologies Publishes Common Mode Choke Application Note Topic Discusses How Common Mode Choke Filtering Improves CMRR in Ethernet Transformer Applications St. Louis, Missouri, USA – June 30, 2011 ...
Newsroom Laird Technologies Releases New Tpcm™ 580SP Series Screen Printable Phase Change Material New Phase Change Material Expands Company’s Thermal Interface Materials Product Line St. Louis, Missouri, USA – April 21, 2011– Laird Techno...
Newsroom Laird Technologies Expands Thermal Gap Filler Product Line with Tputty™ 506 Series Silicone Putty Thermal Gap Filler Specifically Designed for High-Wattage Electronic Applications St. Louis, Missouri, USA – March 24, 2011 – Laird Technolo...
Newsroom Laird Technologies Expands EMI Gemini™ Multi-Extrusion Gasket Product Line Expanded EMI Multi-Extrusion Elastomer Shielding Product Line Includes Gemini™ 81 and Gemini™ 93 Gaskets St. Louis, Missouri, USA – December...
Newsroom Laird Technologies Introduces New Removable Top Board-Level Shield ReCovr™ Product Line Patented Board-Level Shield Sets the Standard for Removable Top Shielding St. Louis, Missouri, USA – November 10, 2010 – Laird Technologies,...
Newsroom Laird Technologies Releases New Tflex™ SF600 DF Silicone-Free Thermal Gap Filler Gap Filler Specifically Designed for Silicone-Sensitive Applications St. Louis, Missouri, USA – October 19, 2010 – Laird Technologies, Inc.,...
Newsroom Laird Technologies Releases New Tflex™ XS400 Series Thermal Gap Filler Compliant Elastomer Gap Filler Provides Electrical Isolation with High Tolerance Stack-Up St. Louis, Missouri, USA – September 21, 2010 – La...
Newsroom Laird Technologies Releases New Rigid Corner Board-Level Shield New Corner Design Optimizes Part Rigidity for Improved Shielding Performance St. Louis, Missouri, USA – September 15, 2010 – Laird Technolog...
