Newsroom LAIRD TECHNOLOGIES COMPLETES DELAWARE WATER GAP LEVEE RECONSTRUCTION PROJECT EMI Manufacturing Site Takes Measures to Protect Plant From Future Floods ST. LOUIS — (May 30, 2006) — Laird Technologies, a leading designe...
Newsroom LAIRD TECHNOLOGIES INTRODUCES THERMALLY CONDUCTIVE T-PREG™ HTD WITH HIGH OPERATING TEMPERATURE AND VOLTAGE RATINGS Thermal Dielectric Used to Make Printed Circuit Boards and Substrates ST. LOUIS — (May 15, 2006) — Laird Technologies, a leading designer an...
Newsroom LAIRD TECHNOLOGIES INTRODUCES NEW PORON CONDUCTIVE FABRIC GASKETS FOR USE IN HANDHELD DEVICES Products Improve LCD Cushioning, EMI Safeguarding ST. LOUIS, MO. USA — (May 1, 2006) —Laird Technologies, a leading designer and manufacture...
Newsroom LAIRD TECHNOLOGIES DEVELOPS DEEP DRAWING CAPABILITY FOR SHIELDING APPLICATIONS Cost-Effective Approach Targets Handheld Devices St. Louis MO. USA — (March 7, 2006) — Laird Technologies, a leading designer and manufactur...
Newsroom LAIRD TECHNOLOGIES THERMAL PRODUCTS LAUNCHES COST-EFFECTIVE T-GARD™ 500 HIGH-PERFORMANCE INSULATOR FOR AUTOMOTIVE INDUSTRY Product Marks First Major Insulator Technology Development in 15 Years Cleveland, OH, USA — March 1, 2006 — Laird Technologies Thermal Produ...
Newsroom LAIRD TECHNOLOGIES TARGETS NETWORK SWITCHING-MODE POWER SUPPLIES WITH LOW COST T-GARD™ FILM-BASED INSULATORS Cleveland, OH USA (March 1, 2006) - Laird Technologies Thermal Product business unit (formerly known as Thermagon), a leading supplier of th...
Newsroom LAIRD TECHNOLOGIES LAUNCHES HI-STRENGTH SNL65HS FORM-IN PLACE EMI SHIELDING GASKET Product Well Matched for Environmental Protection, Rigorous Applications St. Louis, MO. USA — (February 13, 2006) — Laird Technologies, a le...
Newsroom Laird Technologies Introduces T-Grease™ 880, a Thermally Conductive Grease For Advanced Computing Applications Cleveland, OH. USA —November 16, 2005 — Laird Technologies Thermal Products (formerly known as Thermagon) today unveiled T-grease™ 880, its ...
Newsroom Laird Technologies Introduces T-pcm™ 583, A New Thermally Conductive Phase Change Material For Gaming And Computing Devices Cleveland, OH, USA — November 16, 2005 — Laird Technologies Thermal Products (formerly known as Thermagon) today introduced its competitivel...
Newsroom Laird Technologies Unveils Its TFlex™ 300 Ultra Compliant, Thermal Gap Filler For Use in High-Speed Computing and Telecom Applications Cleveland, OH. USA - (November 7, 2005) Laird Technologies Thermal Products (formerly known as Thermagon) today introduced its Tflex™ ...
Newsroom Laird Technologies Introduces New Environmentally Friendly, RoHS Compliant and Flame Retardant EMI Shield St. Louis, MO. USA (October 14, 2005) – Laird Technologies, the world’s leading designer and manufacturer of electromagnetic interference (...
Newsroom Laird Technologies Offers New Metallized Conductive Products Catalog St. Louis MO. USA (September 29, 2005) Laird Technologies, a leading designer and manufacturer of electromagnetic interference (EMI) shieldi...
