Cleveland, OH, USA — November 16, 2005 — Laird Technologies Thermal Products (formerly known as Thermagon) today introduced its competitively priced, high-performance phase change material, T-pcm™ 583. The substance meets the thermal resistance and reliability requirements needed for advanced applications, such as microprocessors, chipsets, graphic processing chips, and custom ASICS, that will power next-generation consumer electronics.
“The T-pcm 583 further strengthens our leadership of phase change thermal interface products due, in part, to its effortless application process, which upon power-up creates a thin bond line and replaces air in all the microscopic spaces on adjoining surfaces to efficiently conduct heat. This is an absolute requirement for fast devices to operate cooler and operate properly,” said Michael Dreyer, Laird’s vice president and general manager of the Thermal Products Division. “That functionality combined with its outstanding thermal execution and low cost surpasses all other commercial high-performance thermal interface products currently available. We expect our customers to experience these advantages immediately and, in particular, when future devices are being designed.”
T-pcm 583 is a non-electrically conductive film that is naturally tacky at room temperature and does not require additional adhesives or preheating for assembly. The easy-to-apply pad begins to soften and flow at 50°C, filling the microscopic irregularities of both the component and thermal solution, thus reducing thermal interface resistance. T-pcm 583 is supplied in strips or rolls with a top-tabbed liner for easy application. Individually die cut shapes also are available. T-pcm 585 is priced for large volume applications under $0.07/in2.
About Laird Technologies Thermal Products
Laird Technologies Thermal Products, a unit of Laird Technologies, is the leading supplier of high-performance gap filler thermal interface materials (TIM), and a growing provider of high-and-low performance thermally conductive greases, insulators, phase-change materials and insulated metal printed circuit boards. Formed in 2002 with Laird Technologies’ decision to build a strong presence in the market for thermal management products and solutions, the division was built on the strategic acquisitions of Thermagon Inc. in 2004, and Orcus Inc., Warth International in 2003. Leveraging Laird Technologies’ global presence, the Thermal Products unit has manufacturing, sales and technical support facilities in the United States, Taiwan, South and East China and the United Kingdom, as well as sales and technical support operations in Japan, Korea and Singapore. Laird Technologies Thermal Products division is based in Cleveland, Ohio.
About Laird Technologies
Laird Technologies is the world’s leading designer and manufacturer of electromagnetic interference [EMI] shielding, telematics, thermal management and wireless antenna solutions for the telecommunications, data-communications, computer, general electronics, network equipment, aerospace, defense, automotive and medical equipment industries.
For additional information or the name of your nearest Laird Technologies’ representative:
Laird Technologies
Phone 1 + (800) 843-4556, 1 + (314) 344-9300
Fax 1 + (314) 344-9333
Internet www.lairdtech.com
E-mail sales@lairdtech.com