Enhance cooling in electronics
With a thermal conductivity of 7.5 W/mK, Tpcm™ 7000 is designed to help engineers overcome stringent thermal challenges and efficiently cool electronics. This new phase change material offers the lowest thermal resistance on the market. As it softens between 50°C –70°C, the initial pad’s thickness can decrease to a bondline as thin as 35µm.
Performance across industries
Tpcm™ 7000 ships on liners yet is easily removable for application. The phase change material offers a high-performance and reliable thermal solution for consumer electronics, as well as datacom and telecom and industrial applications. Features and benefits of Tpcm™ 7000 include:
- Easy application and automation
- 7.5 W/mK bulk thermal conductivity
- No pump out
- Long-term reliability
- Non-silicone formulation that provides naturally tacky surface
- Environmentally friendly solution
- RoHS and REACH compliant
Lasting thermal reliability
- 2,000 hours of aging tests to prove reliability at an operating temperature of 150°C
- Thickness: 0.13mm, 0.2mm, 0.25mm, 0.4mm
- Operating temperature range: -40°C to 125°C
- Softening temperature range: 50°C to 70°C
- Shelf life: 1 year from date of shipment in sealed bag