High thermal conductivity, soft and compliant
As electronics become smaller and more complex, fragility is a top challenge for design engineers. Featuring a soft silicone material and very low residual pressure, the Tflex™ HD7.5 thermal gap filler puts minimal pressure on fragile components. With a thermal conductivity of 7.5W/ mk, the gap filler provides high thermal performance without adding stress to devices.
A pressure-sensitive solution
A soft solution for small, sensitive components, Tflex HD7.5 provides heat transfer for telecom, datacom, consumer electronics and industrial applications.
- 7.5W/ mk thermal conductivity
- Low pressure versus deflection
- Minimizes board and component stress
- Low outgassing and oil bleeding
- Large tolerance applications
Flexible design, global availability
- Thickness: 1mm (0.040") to 5mm (0.200")
- Temperature range: -50°C to 150°C
- Available in standard sheets and die cut converted parts
- Available from our production facilities across the globe