AI servers are really pushing their limits these days, where data speeds of powerful chips help generate a ton of heat that can slow them down and affect their performance. Unfortunately, traditional cooling materials can wear out over time, which can lead to reduced performance, inefficiencies, and expensive maintenance. That’s why a leading tech company partnered with Laird Technologies to implement Laird™ branded Tgel™ 600, a thermal gel which serves as an IC-to-heat sink interface material specifically designed to keep AI components cool and operating smoothly. Offering designers an ability to create ultra-thin bondlines, achieve excellent conductivity, and ensure long-lasting stability, Tgel™ 600 enables consistent performance without needing a burn-in process.
APPLICATION NOTE
TGEL™ 600 TIM: A NEW COOLING STRATEGY FOR AI PLATFORM SERVERS
Abstract
As workloads intensify, hyperscale data facilities face significant thermal management challenges in its high-performance AI server platforms. To address these challenges, a leading tech company partnered with Laird to implement Tgel™ 600, an advanced thermal interface material (TIM) designed for high heat flux dissipation. This application note explores how Tgel™ 600 enhances cooling efficiency, improves system reliability, and simplifies the manufacturing process.
Introduction
With AI models demanding ever-greater compute power, servers generate extreme heat loads, exceeding 1000 watts per chip. The challenge lies in efficiently dissipating this heat while maintaining system reliability and manufacturing efficiency. Traditional thermal greases face issues like pump-out, dry-out, and high voiding rates, leading to performance degradation over time. The client required a high-performance, dispensable thermal gel capable of ultra-thin bondlines, excellent thermal conductivity, and long-term reliability. Laird Tgel™ 600 emerged as the ideal solution, eliminating the need for a burn-in process while ensuring consistent thermal performance across power cycles.
The Challenges
Thin Bondline Requirements
AI chips require bondlines as thin as 20 microns to minimize thermal resistance and maximize heat dissipation.
Phase change materials (PCMs) need a burn-in process, which the customer sought to eliminate for improved manufacturing efficiency.
High Thermal Performance Needs
AI workloads push heat loads beyond 1000W per chip, requiring a TIM that can handle extreme thermal flux.
Thermal resistance must remain low even under high-stress computational loads.
Reliability Concerns
Pump-out and voiding issues in traditional thermal greases reduce thermal performance over time.
Long-term stability is critical to maintaining consistent server operation and reducing maintenance costs.
Need for Rigorous Testing
The client required extensive testing, comparing Tgel™ 600 against competitive TIMs using ASTM standard test vehicles.
Both laboratory simulations and real-world server trials were necessary to validate performance.
The Solution
Laird Tgel™ 600 provides a high-performance, dispensable thermal gel tailored for AI server cooling. It eliminates burn-in processes, simplifies application, and ensures consistent thermal conductivity.
Key Features of Tgel™ 600
High Thermal Conductivity: 6.4 W/m-K for superior heat dissipation.
Ultra-Thin Bondline: Achieves bondlines as low as 20 microns.
No Burn-In Process Required: Begins working immediately after application.
Excellent Pump-Out Resistance: 100–200% better than top thermal greases.
Long-Term Stability: Minimal degradation over thousands of power cycles.
Tgel™ 600 Specifications
| Parameter | Specification |
|---|---|
| Thermal Conductivity | 6.4 W/m-K |
| Minimum Bondline Thickness | 20 microns |
| Pump-Out Resistance | 100–200% better than high-end greases |
| Voiding Rate (After Thermal Cycling) | 3% (vs. up to 20% for greases) |
| Operating Temperature | -40°C to +150°C |
| Application Method | Standard dispensing, screen printing, stenciling |
Implementation and Testing
Testing and Benchmarking Against Competitors
Client team and Laird engineers performed extensive ASTM-compliant testing.
Tgel™ 600 outperformed competing thermal greases in both lab and real-world AI server conditions.
Void testing showed only 3% voiding compared to up to 20% for leading competitor greases.
Application in AI Servers
Easy integration into manufacturing lines using standard dispensing equipment.
Compatible with screen printing and stenciling processes.
Tested across multiple server designs and computational loads.
Improved junction temperatures, allowing sustained AI performance.
Performance Metrics and Test Results
| Test Parameter | Improvement with Tgel™ 600 |
|---|---|
| Bondline Thickness | Achieves ultra-thin 20 microns |
| Thermal Performance vs. Competitors | Equal or better |
| Long-Term Stability | Minimal degradation over power cycles |
| Voiding Rate | 3% (vs. up to 20% for greases) |
| Manufacturing Efficiency | No burn-in process required |
Future-Proofing AI Infrastructure
Laird continues to refine and innovate thermal solutions to meet evolving AI server demands. Tgel™ 600 provides the client with scalable, high-performance cooling, ensuring AI platforms remain reliable as workloads increase.
Benefits
Improved Thermal Management
Lower junction temperatures ensure sustained AI performance.
Higher heat dissipation efficiency allows more compute power without throttling.
Manufacturing Simplification
No melt-in or burn-in process reduces manufacturing time.
Versatile application across multiple server designs minimizes supply chain complexity.
Long-Term Reliability
Reduced pump-out and voiding prevent thermal degradation.
Consistent thermal performance throughout server lifespan reduces maintenance costs.
Conclusion
Laird Tgel™ 600 provides customers with a reliable, efficient, and high-performance thermal management solution for AI computing. The material’s superior thermal conductivity, ultra-thin bondline capability, and long-term stability make it an ideal choice for high-performance AI servers. For data center operators facing similar thermal management challenges, Laird Tgel™ 600 offers a proven, field-tested solution. Contact Laird’s experts today to explore how our advanced thermal management solutions can optimize your data center operations.
Copyright © 2025, Laird Technologies, Inc. DuPont™, the DuPont Oval Logo, Laird™, the Laird Logo, and all trademarks and service marks are owned by DuPont de Nemours, Inc., Laird Technologies, Inc., or their affiliated companies. All rights reserved.