Production came to a halt when a large global manufacturer faced delays due to excessive oil bleeding from silicone-based thermal interface materials. The design team urgently needed a reliable solution, as lens fogging and optical degradation were putting interconnect product performance at risk. Laird Technologies stepped in, ran thorough tests, and discovered the ideal fix — Laird™ branded non-silicone based Tflex™ SF10 gap filler pads. These soft, high thermal conductivity pads are designed to stop oil from spreading while achieving top-notch heat transfer. Our global team helped steady production and speed up order delivery, turning a tricky situation into a win.
APPLICATION NOTE
LAIRD TFLEX™ SF10 ENHANCES THERMAL MANAGEMENT IN OPTICAL INTERCONNECTS
Abstract
As data centers scale to meet the increasing demands of AI and cloud computing, e ective thermal management in optical interconnects has become a critical requirement. A major hardware manufacturer for data centers recently faced significant production challenges due to volatile migration from silicone-based thermal interface materials (TIMs), leading to lens fogging in optical transceivers.
To resolve this, the manufacturer partnered with Laird to implement Tflex™ SF10, a high-performance, silicone-free thermal gap filler. This application note explores how Tflex™ SF10 enhances optical interconnect reliability, improves thermal performance, and ensures long-term operational stability.
Introduction
The miniaturization and increased power density of optical transceivers create significant thermal challenges for data center operators and equipment manufacturers. The customer, a global leader in computing solutions, faced production delays due to the limitations of traditional silicone-based TIMs, which caused volatile migration issues that led to lens fogging and optical degradation. To address this challenge, the customer required a high-conductivity, non-silicone TIM that could maintain optimal performance while preventing contamination. Laird’s Tflex™ SF10 emerged as the ideal solution, providing exceptional thermal properties while eliminating silicone migration concerns.
The Challenges
Oil Bleed and Lens Fogging Issues
Silicone-based TIMs caused volatile migration, leading to lens fogging and optical degradation.
Production lines were halted for over a month, causing significant order backlogs.
High Thermal Performance Needs
Optical transceivers operate at high data rates, generating substantial heat.
A thermal conductivity of at least 10 W/mK was required for effective heat dissipation.
Reliability Concerns
Long-term material stability was critical to prevent TIM degradation.
The TIM needed to maintain consistent performance across power cycles.
Scalability and Rapid Implementation
Customer required a quick ramp-up to meet high production demands.
The solution had to be easily integrated into existing manufacturing processes.
The Solution
Laird’s Tflex™ SF10 is a high-performance, siliconefree thermal gap filler engineered to meet the stringent requirements of optical transceivers. It eliminates the silicone oil migration issues associatedwith traditional TIMs while maintaining superior thermal conductivity.
Key Features of Tflex™ SF10
Silicone Free Formulation: Eliminates silicone based migration and volatilization which are often associated with detrimental lens fogging.
High Thermal Conductivity: 10 W/mK for optimal heat dissipation.
Low Shore Hardness: Minimizes mechanical stress on fragile optical components.
Excellent Deflection Properties: Ensures consistent performance with minimal applied pressure.
TflexTM SF10 Specifications
Parameter | Specification |
|---|---|
| Thermal Conductivity | 10 W/mK |
| Shore Hardness | Low (minimizes stress on components) |
| Silicone Oil Migration | Eliminated (Silicone-Free) |
| Operating Temperature Range | -40°C to +125°C |
| Compliance | REACH, RoHS, UL 94 V-0 Compliant |
| Application Method | Custom die-cut pads, automated dispensing |
Implementation and Testing
Collaboration with Customer
Laird engineers worked closely with the customer team to customize and validate Tflex™ SF10 for optical transceiver applications.
Conducted extensive oil bleed and fogging tests to meet the customer’s stringent optical clarity requirements.
Testing and Benchmarking Against Competitors
The customer performed side-by-side comparisons with existing TIMs.
Tflex™ SF10 eliminated silicone oil migration while maintaining superior thermal properties.
Accelerated aging tests demonstrated long-term reliability.
Scaling Up for Production
Laird expanded manufacturing capabilities, adding new equipment and personnel.
Production was scaled to a second site in Tianjin, China, ensuring supply chain resilience.
Performance Metrics and Test Results
Test Parameter | Improvement with TflexTM SF10 |
|---|---|
| Oil Bleed | Reduced (vs. severe in silicone TIMs) |
| Optical Performance | Improved lens fogging (vs. previous contamination issues) |
| Thermal Conductivity | 10 W/mK (exceeds industry standards) |
| Long-Term Stability | Minimal degradation over power cycles |
| Manufacturing Efficiency | Seamless integration, no process disruptions |
Benefits for Manufacturer
Improved Optical and Thermal Performance
Lower operating temperatures ensured consistent transceiver efficiency.
Improved lens fogging, preventing optical signal degradation.
Manufacturing Efficiency and Scalability
Immediate usability reduced rework and production delays.
Seamless integration into existing optical transceiver production lines.
Long-Term Reliability
No silicone oil bleed ensures stable operation across extended deployment cycles.
Long-term material integrity minimizes maintenance and replacements.
Best Practices for Implementation
Application Guidelines
Early Engagement: Collaborate with Laird engineers early in the design process.
Custom Testing: Conduct application-specific tests for optimized performance.
Mechanical Tolerance Considerations: Ensure precise gap sizing for best performance.
Accelerated Aging Tests: Validate long-term material stability and reliability.
Future Expansion and Additional Applications
The customer’s success with Tflex™ SF10 in optical transceivers led to its adoption across multiple product lines, including:
100G SFP modules to 800G OSFP modules.
AI accelerators for cloud computing.
High-performance server CPUs and GPUs.
Silicon photonics devices.
The TIM’s high thermal conductivity and cleanliness make it a prime candidate for additional high-power data center applications.
Laird’s Collaborative Approach
The success of Tflex™ SF10 highlights Laird’s commitment to collaborative problem-solving. Laird provided the client with:
Rapid response to production challenges.
Custom testing and quality assurance processes.
Scalable manufacturing solutions.
Ongoing engineering support for future applications.
Conclusion
Laird Tflex™ SF10 has proven to be an industryleading thermal solution for optical transceivers, helping the customer overcome critical production and performance challenges. The silicone-free formulation, high thermal conductivity, and long-term stability make it a gold standard for optical and data center applications.
For engineers developing next-generation data center technologies, Tflex™ SF10 provides a field-tested, high-performance solution.
Contact Laird’s experts today to explore how our advanced thermal management solutions can enhance your designs and optimize operational e ciency.
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