Read how Laird Technologies helped a leading semiconductor manufacturer resolve electromagnetic interference (EMI) challenges in compact GPU designs. Performance was disrupted by excessive electrical noise from switched-mode power supplies (SMPS) operating at 1.5 MHz and 3 MHz. Conventional shielding materials were too large for the available space. Laird created ultra-thin, high-performance ferrite sheets that effectively suppressed EMI- without affecting form factor or the team’s overall thermal management progress. Designed for durability and high-volume resistance, these sheets suppressed radiated emissions and ensured compliance with industry standards while maintaining stable GPU performance.
APPLICATION NOTE
LAIRD HIGH-PERFORMANCE FERRITE SHEETS BLOCK EMI IN COMPACT GPU DESIGNS
Abstract
Electromagnetic interference (EMI) presents a significant challenge in high-density GPU designs, where compact layouts and increasing power demands exacerbate noise coupling. This application note outlines how a major chip manufacturer addressed EMI issues caused by switched-mode power supplies (SMPS) using advanced ferrite sheet solutions from Laird. By replacing bulky ferrite tiles with ultra-thin, high-performance ferrite sheets, the customer achieved effective EMI suppression without compromising thermal management or increasing form factor constraints.
Introduction
The rapid advancement of artificial intelligence (AI) has escalated the demand for highperformance GPUs, leading to increased power densities and heightened electromagnetic interference risks. A leading semiconductor manufacturer faced EMI compliance challenges in their AI GPU cards due to conducted emissions from the SMPS, specifically at 1.5MHz and 3MHz. Initial mitigation attempts using ferrite tiles proved ineffective due to space constraints. To resolve this, the company collaborated with Laird, leveraging their expertise in EMI suppression and material science.
The Challenges
Large Heatsink Coupling and Harmonics
Conducted emissions from SMPS led to EMC test failures.
Harmonic frequencies at 1.5MHz and 3MHz propagated through heatsinks, causing interference.
Space Constraints
Traditional ferrite tiles were too thick for the client’s compact GPU designs
Inductor-to-heatsink spacing limited bulky EMI shielding options.
High Operating Temperatures
AI GPUs generate extreme heat, requiring EMI solutions that withstand high temperatures.
Fire retardancy and durability were critical considerations.
Tight Development Timeline
The customer required a rapid EMI mitigation solution to avoid production delays.
Solutions needed to be tested and implemented within weeks.
Solution: Ultra-Thin Ferrite Sheets
Advanced ferrite sheets developed by Laird provided a space-efficient solution for EMI suppression in the new GPUs. Through rapid prototyping and testing, Laird developed an optimized ferrite sheet configuration that blocked inductor noise coupling to the heatsink, ensuring EMC compliance.
Key Features of High-Performance Ferrite Sheets
Ultra-Thin Design: Available in thicknesses as low as 0.05 mm, ensuring minimal space impact.
High-Volume Resistance: NiZn composition for effective EMI shielding across broad frequency ranges.
Temperature Stability: Withstands operating temperatures from -40°C to +85°C.
Fire Retardancy: Compliant with UL94 V0 standards.
Customizable Form Factor: Available in multiple configurations to fit diverse GPU designs.
Ferrite Sheet Specifications
| Parameter | Specification |
|---|---|
| Standard Thickness | 0.05 mm, 0.1 mm, 0.2 mm |
| Operating Temperature | -40°C to +85°C |
| Material Composition | NiZn Ferrite |
| Compliance | RoHS, UL94 V0 |
| Customization | Sizes, thicknesses, and adhesives |
Implementation and Design Considerations
Optimal Placement for EMI Suppression
Engineers identified the most effective placement between power inductors and heatsinks.
Thin sheets enabled EMI shielding without altering thermal dissipation pathways.
Integration into Existing Designs
Sheets were customized for precise dimensions, allowing seamless integration into compact layouts.
Laird collaborated with the client team on automated application techniques for consistent placement in mass production.
Thermal and Mechanical Considerations
Custom PET protection layers and pressure sensitive adhesives (PSAs) ensured durability and reliability.
Solutions maintained performance through power cycling without material degradation.
Performance Metrics and Test Results
High-performance ferrite sheets significantly improved the product’s EMI performance, enabling compliance with regulatory standards.
| Test Parameter | Improvement |
|---|---|
| Conducted Emissions at 1.5MHz & 3MHz | Significant reduction |
| Harmonic Attenuation (5th, 7th, 11th) | Effective suppression |
| Thermal Performance Impact | Minimal |
| Compliance with EMC Standards | Achieved |
Future-Proofing AI GPU Designs
The success of this project underscores the scalability of Laird ferrite sheet solutions for future GPU designs. As AI workloads continue to grow, EMI suppression strategies must evolve. Laird remains committed to ongoing research and development in materials science to address emerging EMI challenges in AI computing.
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