Leading thermal resistance
Capitalizing on DuPont innovation, Ttape™ 1000A thermally conductive adhesive tape offers extremely low thermal resistance. A stand-alone adhesive, Ttape™ 1000A provides strong adhesion when bonding a heat sink to an IC chip without requiring mechanical fasteners or clamping devices. The superior wetting properties of Ttape™, along with the 50 μm thickness contribute to leading-edge thermal transfer. Long-term reliability studies indicate both improvement in adhesion and thermal transfer. This tape product complements Laird's current thermal product offerings of gap fillers, greases, films and more.
Conformability and adhesion
With low thermal resistance and a high degree of substrate conformability and adhesion, Ttape™ 1000A is the ideal thermal solution for high-heat applications across a range of industries, including consumer electronics, telecommunications, aerospace and defense, automotive, datacom, medical advices, and more. Features and benefits of this thermally conductive adhesive tape include:
- Best-in-class thermal performance at 1.3°C-cm2/W at 100 psi
- High mechanical strength
- Specialized acrylic formulation
- RoHS compliant
- UL pending
Available in a range of sizes
- Thickness: 0.05mm with a thickness tolerance of ±10%
- Thermal conductivity: 0.7 W/mK
- 90° peel strength: 2.7 N/cm (1.5 lbs/in)
- Lap shear strength: 30 psi
- Available in standard sheets and rolls (457mm x 457mm sheets, 457mm x 57mm rolls, 228mm x 228mm sheets, 228mm x 75mm rolls, 25mm x 5mm rolls)
- Available in custom die cut parts (stand alone or on rolls)