Introducing Tflex™ SF10
Provides superior thermal performance without overstressing boards and components.
Enhanced thermal conductivity
Tflex SF10 is a soft, non-silicone gap filler that offers superior thermal performance for applications across industries, including consumer electronics, industrial and telecom.
Reduce pressure on components
Extremely soft with excellent deflection properties, Tflex SF10 puts minimal pressure on components. Features and benefits of the gap filler include:
- Non-silicone formulation
- Low shore hardness
- Low pressure versus deflection
- Low relaxation pressure, minimizes board and component stress
- No fiberglass reinforcement
Flexible design, global availability
- Thickness: 0.5mm to 4 mm (0.020”- 0.160”) in 0.25 (0.010”) increments
- Temperature range: -40° C to 125° C
- Available in sheet form (18” x 18” or 9” x 9”) or custom converted parts
- Manufactured in Cleveland, Ohio. Available in Europe and Asia via Laird facilities in Liberec, Shenzhen and Shanghai