Boost thermal performance with non-silicone based gap filler

Introducing Tflex™ SF10

Provides superior thermal performance without overstressing boards and components. 

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Enhanced thermal conductivity

Tflex SF10 is a soft, non-silicone based gap filler that offers superior thermal performance for applications across industries, including consumer electronics, industrial and telecom.

Reduce pressure on components

Extremely soft with excellent deflection properties, Tflex SF10 puts minimal pressure on components. Features and benefits of the gap filler include:

  • Non-silicone based formulation
  • Low shore hardness
  • Low pressure versus deflection
  • Low relaxation pressure, minimizes board and component stress
  • No fiberglass reinforcement
Reduce pressure on components
Flexible design, global availability

Flexible design, global availability

  • Thickness:  0.5mm to 4 mm (0.020”- 0.160”) in 0.25 (0.010”) increments
  • Temperature range: -40° C to 125° C
  • Available in sheet form (18” x 18” or 9” x 9”) or custom converted parts
  • Manufactured in Cleveland, Ohio. Available in Europe and Asia via Laird facilities in Liberec, Shenzhen and Shanghai

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