Introducing Tflex HP34
A silicone-free high-performance gap filler with excellent deflection properties.
High conductivity under pressure
This high performing gap filler consists of graphite fibers expertly aligned to provide a very high bulk thermal conductivity. In addition to the high bulk Tc, Tflex HP34 is uniquely designed to maintain its thermal performance within an application under increased pressure. Compared to typical graphite-based materials, Tflex HP34 is considerably softer with excellent deflection properties.
Reliable heat transfer across applications
Our high performing thermal gap filler is ideal for applications in 5G/telecom, data infrastructure, aerospace and defense, automotive, datacom, consumer electronics, and servers. Features and benefits of Tflex HP34 include:
- 34 w/mK bulk thermal conductivity
- Silicone-free formulation
- Maintains thermal performance under increased pressure
- Low contact resistance with mating surfaces
- Low or no oil bleed
- Environmentally friendly solution that meets RoHS and REACH
A soft solution with low contact resistance
- Temperature range: -40°C to 125°C
- Thickness: 1mm to 5mm
- Density: 2.3 g/cc
- Available in a standard sheet size of 76.2mm x 127mm (3” x 5”) or custom die cut parts
- Naturally tacky material, no need for added adhesive layers