SNN55-RXP

Form-in-Place Gasket

Product Description

Laird’s Form-In-Place is an automated system for dispensing non-conductive and conductive elastomer EMI shielding and grounding gaskets onto metal substrates. This product is particularly ideal for base stations, PDAs, PC cards, radios, and mobile phones, as well as many other cast enclosures and packaged electronic assemblies.
SNN65 HxP FIP 2

Features and Benefits

  • Form-in-place gasketing offers a total cost savings in the form of reduced raw materials, labor or assembly time.
  • Room temperature cure gasketing materials eliminate the need for costly heat curing systems, allowing the use of inexpensive plastic or metal substrates.
  • Single-component compounds eliminate the need for mixing ingredients, thereby shortening production cycles and eliminating related waste.
  • Easy to program operating system allows for quick part-to-part changeover, minimal tooling investment for new designs, and prototype development in 24 to 48 hours.
  • High shielding effectiveness: 85–100 dB up to 10 GHz.

Capabilities

  1. Automated Packaging
  2. Custom Automation
  3. Custom Product Development
  4. Prototyping
  5. Service
  6. Testing

Technical Specification

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    Part NumberPart NameShielding EffectivenessCompression SetHardnessOperating Temperature Max (Celsius)Operating Temperature Min (Celsius)
    SNN55RXP-300CC"Form-in-Place Conductive Silicone Elastomer, 55 Shore A"
    >80 dB
    15
    55 Shore A
    125.00
    -50.00