Design engineers and colleagues from around the globe are encouraged to JOIN US at 10:00 am USCST on Tuesday, March 23, for the second of our two-part series of live, candid discussions on electronic enablement and device protection challenges.
In Resolution Roundtable Session 2, Moderator Shelby Ball, North America’s manager of Laird field application engineering, will assemble three highly respected problem solvers from his FAE team. From their experience in the field, they will recall selected issues they have encountered and problems they have resolved in the area of thermal management. All resulted in successful projects. Specifically, join us for:
Live discussion 1 – How our Laird FAE helped a company create both EMI shielding and thermal protection for a small device operating in high humidity conditions
Live discussion 2 – How another FAE assisted a company battling a liquid gap filler (Tputty) using a thermal grease
Live discussion 3 – How a board level shield optimized to enable thermal transfer solved dual issues facing a device manufacturer, following detailed Laird FAE consultation
This will be a 45-minute roundtable discussion.
Schedule the time and join Laird for added insight, education and enlightenment.
We will see you March 23rd for Resolution Roundtable Session 2.