As consumer, commercial, and industrial electronics continue to shrink, run faster, and have higher performance levels, EMI shielding, weight reduction, and heat dissipation will continue to challenge design engineers and OEMs across the country and around the globe and require innovative board-level shielding as well as close collaboration between design and manufacturing.
That was the topic a feature co-authored by two Laird experts in board level shielding. Paul Crotty, Director of Engineering and Technology for EMI Metals and Precision Metals Product Manager, Sean Honer, which discusses the growing demand for thinner, lighter, hybrid board level shields that protect electronics from electromagnetic interference and heat.
The feature was published by industry leading Design News which claims to reach the "largest trusted community of design engineers in the horizontal engineering space.
Featuring a side-by-side comparison of different solutions including aluminum, steel, and copper, the piece discusses how design engineers can maximize performance while minimizing the size of their final product by leveraging the right solution for a specific application.
To learn more about the board level shielding solutions from Laird, CLICK HERE.
To read the full article from Design News CLICK HERE.