SLG

Soft HB-SMD Foam Contact

Product Description

Laird Performance Materials’ HB-SMD is one of the Soft SMD (Surface Mount Device) Contact series which is used for circuit grounding and shielding of SMT (Surface Mount Technology) devices. This contact is designed to be solder reflow compatible and suitable for automatic processing.  HB-SMD is composited of a tin/copper PIfilm over polyurethane foam with rectangular shape (SLG series) and hourglass shape (SLH series).

Features and Benefits

  • Sn/Cu Plated PI Film outer layer
  • Polymeric Foam Core
  • Soft SMD contacts are ROHS compliant
  • Halogen-free per IEC-61249-2-21 standard
  • Reflow tunnel compatible to 260°C
  • UL94 HB Flammability Rating
  • Length Options: ≥3 mm
  • Width Options: ≥3 mm
  • Z Axis Resistance Range:  @30% compression before reflow Ω <0.10 after reflow <0.10 (Larid internal 5mm x5mm x5mm)

Capabilities

  1. Automated Packaging
  2. Custom Automation
  3. Custom Product Development
  4. Prototyping
  5. Service
  6. Testing

Datasheets

Soft HB-SMD Foam Contact Datasheet Last updated02/01/22

Technical Specification

  • Typical Properties
    Construction and Composition
    Metallized PI film over Polyurethane Foam
    Gasket Profile
    Rectangular
    Operating Temperature Max (Celsius)
    85
    Operating Temperature Min (Celsius)
    -40
    Solderable
    Yes
  • Mechanical Properties
    Compression Set
    <20%
  • Dimensions
    Thickness Range (mm)
    ≥ 1.5 mm
  • Compliance
    ROHS Compliant
    Yes
    UL Flammability Rating
    UL94 HB