Gap Fillers

Thermal Interface Materials

What are Gap Fillers?

Thermal gap fillers are valuable aids as electronic component heat dissipation materials because of their thermal conductivity properties. They fill spaces and replace the air from them. Air is a poor conductor of heat. Aided by their thermal conductivity properties, gap fillers are scientifically engineered to increase overall heat transfer inside a device or system. They keep components cooler and within allowable thermal ranges.

A gap filler is a class of thermal interface materials that fills “a large gap” between heat generating and heat dissipating surfaces. Often, one gap filler can cover multiple heat sources within an application. The material can be placed across three different heat sources with varying heights. A gap filler material is expected to be compliant without generating too much pressure within the system. Gap fillers are usually silicone based because silicone has many attractive properties such as surface wetting, high thermal stability, and physical inertness. Newer offerings can contain no silicone. The silicone is normally used as the binder within a gap filler system. The silicone matrix is then filled with thermally conductive fillers - BN, ZnO, and alumina. These fillers make up the functional portion of the gap filler which gives it its thermal properties. Standard thicknesses of gap fillers tend to be 0.25-5mm (10-200 mils). They feature deflection without excessive pressure. Gap fillers need to be relatively compliant to achieve high deflections without generating excess pressure within an application.

The optimal properties of gap filler materials include low total thermal resistance, high thermal conductivity, and low contact resistance (good surface wetting).  They should be easy to handle. There is a need for low outgassing/low bleeding. Excessive outgassing can cause silicone to condense and build up on optical applications.

Also check out Laird's liquid gap fillers

How do They Work?

Thermal gap fillers are formulated in the lab and placed into electronic devices and systems to get into those small pockets of air, small gaps in space between hot components and a chassis or heat sink assembly. These gaps create thermal barriers to heat transfer due to the low thermal conductivity of air. Gap filler formulations provide the answer using their high thermal conductivity. They bridge what had been an air-filled interface. Gap fillers successfully transfer heat from sensitive components and help keep devices compliant and within prescribed heat limits.

What are Common Uses?

Gap fillers are use widely to help resolve heat mitigation issues in electronic devices. Some of the industries and products utilizing gap fillers are automotive ADAS, automotive lighting, infotainment and powertrain, drones/satellites, gaming systems, instrumentation, notebooks/tablets, portable devices, routers, smart home devices, test and measurement equipment, and wireless infrastructure.

Gap Fillers

Gap Fillers Series

Tflex 300TG

Tflex 300TG is a silicone based gap filler with thermal conductivity of 1.2W/mK and integrated Tgard liner.
Tflex 700

Tflex 700

Tflex 700 is a 5 W/mK soft gap filler thermal interface material with great thermal.
Tflex HD90000

Tflex HD90000

Laird Tflex HD90000 is an extremely soft silicone based 7.5 W/mK gap filler material in our high deflection line of products.
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Tflex SF600

Tflex SF600 is a high performance silicone-free thermal gap filler with a conductivity of 3.0 W/mK.
Tflex UT20000 Photo

Tflex UT20000

Tflex UT20000 is an ultra-thin gap filler that offers excellent thermal performance and high compliancy.

Tflex™ 300

The Laird™ Tflex™ 300 silicone based soft gap filler has a thermal conductivity of 1.2W/mK.

Tflex™ 50000

The Laird™ Tflex™ 50000 silicone based gap filler has a thermal conductivity of 3.0W/mK.
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Tflex™ 600

The Laird™ Tflex™ 600 gap filler is exceptionally soft. This highly compliant gap filler has a thermal conductivity of 3 W/mK.
Tflex B200

Tflex™ B200

The Laird™ Tflex™ B200 gap filler offers good thermal performance and handling with enforcement options for a variety of application.
Tflex HD300 Primary Image

Tflex™ HD300

The Laird™ Tflex™ HD300 product is a silicone based 2.7 W/mK gap filler material in the high deflection line of products.

Tflex™ HD300TG

The Laird™ Tflex™ HD300TG product is a silicone based 2.7 W/mK gap filler material with an integrated Tgard™ liner
Tflex HD7.5 Image

Tflex™ HD7.5

Tflex™ HD7.5 gap filler is a new developed very soft silicone material in our high deflection series
Tflex HD700

Tflex™ HD700

The Laird™ Tflex™ HD700 gap filler product is a silicone based 5.0 W/mK material in the high deflection line of products.
Tflex HD80000

Tflex™ HD80000

The Laird™ Tflex™ HD80000 silicone gap filler is a soft 6.0 W/mK material in the high deflection line of products.

Tflex™ HP34

The Laird™ Tflex™ HP34 gap filler material consists of graphite fibers expertly aligned to provide a very high bulk thermal conductivity.
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Tflex™ HR400

The Laird™ Tflex™ HR400 silicone based gap filler has a thermal conductivity of 1.8W/mK.
Tflex HR600

Tflex™ HR600

The Laird™ Tflex™ HR600 gap filler is a mid performance compliant material with great handling properties for ease of application.
Tflex P100 Primary Image

Tflex™ P100

The Laird™ Tflex™ P100 material consists of a soft and compliant silicone gap filler with an integrated Tgard™ liner.
Tflex P300

Tflex™ P300

The Laird™ Tflex™ P300 material consists of a soft and compliant gap filler with an integrated polyimide liner.
Silicone Free Thermal Gap Filler Tflex SF10

Tflex™ SF10

The Laird™ Tflex™ SF10 product is an innovative, high performing gap filler material with 10W/mk thermal conductivity.

Tflex™ SF800

The Laird™ Tflex™ SF800 product is a high performance silicone-free thermal gap filler with a conductivity of 7.8 W/mK.

Tgon 800

The Laird™ Tgon™ 800 product is an electrically conductive natural graphite thermal gap filler.
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Tpli™ 200

The Laird™ Tpli™ 200 material is an exceptionally soft, highly compressible gap filler
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Tputty ™ 502

The Laird™ Tputty™ 502 material is an extremely soft and compliant gap filler with a thermal condutivity of 3 W/mk